Ultratech, Inc.
Apr 30, 2007

Chipbond Orders Ultratech Lithography System for 300mm Solder Bump Ramp

Industry-Standard Ultratech AP300 Enables Cost Effective Lithography Solution for Packaging Foundries

SAN JOSE, Calif., April 30, 2007 /PRNewswire-FirstCall via COMTEX News Network/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductors and nanotechnology devices, today announced that Chipbond Technology Corp. (Hsin-chu, Taiwan), one of the world's largest merchant gold-bump foundries, has ordered Ultratech's Unity AP300 advanced-packaging (AP) lithography tool. Building on the successful implementation of the Unity platform for gold bump, Chipbond will employ the Unity AP300 to support its migration into 300mm solder-bump processing. The AP300 is built on Ultratech's customizable Unity Platform(TM), which provides the best cost-of-ownership (CoO), operational flexibility and technology extendibility essential for foundries to maintain their competitive technology roadmaps.

According to Jan Vardaman, president and founder of TechSearch International, Inc., the 300mm bump market, with a compound annual growth rate of more than 42 percent, is the fastest-growing segment of the flip chip market. As a result, many of the new bump line installations for solder and wafer-level packaging will be 300mm lines.

"This order reinforces Ultratech's AP300 system as the industry standard for the growing foundry market, where requirements are primarily driven by economic factors," said Manish Ranjan, director, product marketing at Ultratech. "We greatly value our strong relationship with Chipbond and look forward to supporting the company's technology roadmap and migration to 300mm solder-bump processing."

Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; cyclicality in the semiconductor and nanotechnology industries; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; expiration of licensing arrangements, and the resulting adverse impact on our licensing revenues; changes to financial accounting standards; changes in pricing by us, our competitors or suppliers; customer concentration; international sales; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon us achieving and maintaining profitability and the market price of our stock; mix of products sold; rapid technological change and the importance of timely product introductions; outcome of litigation; changes in accounting policies or interpretations of such policies; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; effects of certain anti-takeover provisions; future acquisitions; volatility of stock price; foreign government regulations and restrictions, the political restrictions in Taiwan regarding offshore investments and the exporting of sensitive technologies and jobs to certain countries; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2006 and Quarterly Report on Form 10-Q for the quarter ended March 31, 2007. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to reflect any event or circumstance that may arise after the date of this release.

About Chipbond: Founded in 1997 by semiconductor industry veterans, Chipbond Technology was the early pioneer in providing wafer-bumping services to Taiwan, and has been growing at a steady pace to become a technology leader in the industry. Located in Taiwan's Hsin-chu Science-Based Industrial Park. Both gold bumping and solder bumping services are available for customers' advanced packaging technology requirements. In addition to wafer bumping, Chipbond is also providing tape carrier packaging (TPC) and chip on glass (COG) turnkey solutions especially targeted toward a range of display driver ICs. More information is available at www.chipbond.com.tw.

About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductor and nanotechnology devices, and has expanded its technology scope in pioneering laser processing technology for IC manufacturing. Founded in 1979, Ultratech is a market leader in gold and solder bump lithography. Its products are designed to substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com.

NOTE: Unity Platform is a trademark of Ultratech, Inc.

(UTEK-G)

SOURCE Ultratech, Inc.

Bruce R. Wright, Senior Vice President & CFO, or Laura Rebouche, Vice President,
Investor Relations and Corporate Communications, both of Ultratech, +1-408-321-8835,
or fax, +1-408-577-3379, or lrebouche@ultratech.com; or Angie Kellen, Account
Director of MCA, +1-650-968-8900, or fax, +1-650-968-8990, or akellen@mcapr.com, for
Ultratech
http://www.chipbond.com.tw/

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